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Copper (Cu) Sputtering Targets

Copper (Cu) Sputtering Targets

    Copper (Cu) Sputtering Targets


Copper is one of the most highly utilized elements in the world with evidence of its usage found during ancient times. It is reddish-orange in color with a melting point of 1,083°C, a density of 8.92 g/cc, and a vapor pressure of 10-4 Torr at 1,017°C. Two of the most popular alloys in the world, brass and bronze, contain copper. It is known to be an excellent conductor of heat and electricity and can be found in wire, coins, and electromagnets. The vacuum industry relies heavily on copper material for backing plates which are bonded to sputtering targets. Copper, along with its alloys and compounds, are evaporated under vacuum to form layers in the manufacture of semiconductors, sensors, and circuit devices.

Copper (Cu) Specifications

Material Type

Copper

Symbol

Cu

Atomic Weight

63.546

Atomic Number

29

Color/Appearance

Copper, Metallic

Thermal Conductivity

400 W/m.K

Melting Point (°C)

1,083

Coefficient of Thermal   Expansion

16.5 x 10-6/K

Theoretical Density   (g/cc)

8.92

Z Ratio

0.437

Sputter

DC

Max Power Density

(Watts/Square Inch)

200*

Type of Bond

Indium, Elastomer

Comments

Adhesion poor. Use   interlayer (Cr). Evaporates using any source material.


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