UVLED debonding machine refers to the use of multiple sets of LED chips processed according to a certain proportion and optical principle, and can emit ultraviolet equipment with a surface spot of 310*310mm. The time of this equipment is controllable in real time, and the power density is adjustable. The main wavelengths are 365nm, 385nm, 395nm, 405nm
debonding machine Scope of application:
The UVLED debonding machine solves the debonding process of wafer, glass and ceramic cutting processes. The applicable industries are mainly the semiconductor packaging industry, as well as UV films for semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, mobile hard disks, etc. Degumming use. Most of the UV dissolving machines using UV mercury lamps in the process have the disadvantage of high heat emission, which is easy to damage heat-sensitive materials, and has low efficiency.
debonding machine parameters:
Name | Specification | Unit | Parameter |
UVLED degumming machine | Optional channel | Channel | CH1,CH2,CH3,CH4 |
Power settings | mw/cm2 | Adjustable between 0%--100% |
Irradiation Mode | Manual mode | Touch, foot pedal, 0-10V |
Automatic mode | Real time control |
Advanced Mode | Time and power cycling steps are controllable |
Control mode | Four | Touch,foot pedal,0-10V,PLC control, encoder control |
Optional voltage | 100-240VAC 50/60HZ |
LED type | UV LED |
Wavelength range | nm | 365,385,395,405 |
Luminous size | mm | 310*310 |
Recommended distance range | mm | 30 |
Irradiation power range | mw/cm2 | 45-450 |
Cooling method | Mandatory | Air cooling |
LED life | H | 20000-30000 |
Electric power | W | 1000W |
Use ambient temperature/humidity | 5±40℃ 20-85% |
Storage ambient temperature/humidity | -10±60℃ 20-85% |
Degumming size | Inch | 4/6/8/10 |
Power cable | Cable | m | 2 |
