Semiconductor packaging wafer laminating machine

The manual wafer laminator machine series is a fast and efficient laminating machine specially designed for wafer, glass, LED, PCB and ceramic cutting processes. Adjusted) pressure roller and table design, not only can adapt to products of different thicknesses, but also minimize the stress of the film, so that the product is not damaged. Easy to use, you can get started right away without training.

wafer laminator function:

Suitable for blue film, UV film, PET backing film and double layer film. An optional microporous lamination stage can be applied to ultra-thin wafers. The heated and elastic lamination platen is designed to adapt to different thicknesses of wafers. Unique film roller pressure adjustable design. Equipped with circular and cross-cutting knives. Optional ion air bar electrostatic removal device. Small size, desktop display type.

Manual laminating machine: The specially designed film-saving structure makes the manual laminating machine series a manual laminating machine with high film saving, which can save about 15% compared with ordinary manual laminating machines, which greatly reduces the cost of laminating for customers; at present or in the future Cost savings are even more pronounced when using expensive UV films. Microporous lamination stage for ultra-thin wafers (optional): The microporous design of the lamination stage plus the unique gas path design and elastic support structure can be applied to wafers, glass or ceramics with a minimum thickness of 100um; This structure and the roller device equipped with air flexible elastic force and adjustable elastic force can minimize the damage to the ultra-thin wafer when the film is attached, and greatly reduce the probability of fragmentation. Anti-static Teflon surface treatment film lamination table with heating function and elasticity: The table table design with heating and adjustable heating temperature range ensures that the film bonding effect can be adjusted to the ideal state. The elastic platen adapts to different thicknesses of wafers, glass or ceramics. The surface anti-static Teflon treatment can not only minimize the static electricity generated when the film is attached, but also effectively prevent physical scratches to the chip.

wafer laminator Technical parameter: