CY-MSP210S-RFD small dual-target magnetron sputtering coater equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, greatly reducing the installation site requirements. The magnetron sputtering coater equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests.
Technical parameters of magnetron sputtering coater equipment:
Sample stage | Size | φ150mm |
Rotating speed | 0-20 adjustable |
Heating | Up to 500℃ |
Magnetron sputtering target | Quantity | 2” x2 dual targets share a baffle |
Vacuum chamber | Chamber size | φ210mm x 230mm |
Chamber material | SS304 stainless steel |
Observation window | φ40mm |
Opening method | Front door |
Vacuum system | Mechanical pump | Imported oil-free diaphragm pump |
Pumping interface | KF16 |
Molecular pump | Imported molecular pump |
Pumping interface | KF40 |
Exhaust interface | KF16 |
Vacuum measurement | Resistance gauge + ionization gauge |
Ultimate vacuum | 1.0E-3Pa |
Pumping rate | Oil-free pump 0.49L/s Molecular pump: 40L/S |
Power supply | AC 220V 50/60Hz |
Power configuration | Quantity | DC power supply x1 RF power supply x1 |
Maximum output power | DC power supply 500W RF power supply 500W |
Other | Supply voltage | AC220V, 50Hz |
Total power | 2kW |
Overall size | 550mm x 550mm x1100mm |
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