Home > Products > Grinding & Polishing Machine
888

8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802

    CY-EQ-UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture (optional), the Unipol 802 can lap and polish various samples automatically.

Basic Info


  • Model NO.: EQ-Unipol-802

  • Structure: Desktop

  • Certification: CE, ISO

  • Type: Lapping Machine

  • Trademark: CYKY

  • Specification: polishing machine

  • Customized: Non-Customized

  • Material: Steel

  • Application: School, Lab

  • Product Name: Lapping and Polishing Machine

  • Transport Package: Wooden Case

  • Origin: China


Product Description


8" Precision Auto Lapping and Polishing Machine with two work stations CY- EQ-Unipol-802

Description of the auto lapping and polishing machine:CY-EQ-UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture (optional), the Unipol 802 can lap and polish various samples automatically.

Specification of the auto lapping and polishing machine:

PowerAC 110V and 208-240V (50/60Hz) switchable for worldwide operation.
FeaturesOne cast iron plate for lapping and one cast aluminum plate for polishing.
Two rocking workstations with wafer holders and condition rings can be controlled independently for polishing 2 pcs of 3" wafers in one running.
Super-Flat 8" Lapping PlateFlatness < 2.5 micron / inch²
Precision Rotating ShaftRunning Off < 5 micron
Aluminum CaseHeavy Duty Cast with Bright Painting (Color: Black)
Two Work Stations Rocking Speed8° Rocking with adjustable speed of 0 - 20 rocking / minute
Two Flat Sample Holders80 Dia. x 35 T mm for carrying <3" diameter wafer
Two Condition Rings95 O.D. x 88 I.D. x 32 T mm
Master Plate Speed Range0 ~~ 125 rpm variable with digital display
Operation Timer0 - 99 hours
Motor300 W high torque DC motor
Dimensions525 L x 350 W x 325 H (mm)
Net Weight120 lbs
Optional PartsAutomatic Slurry Feeder 2" Polishing Fixture for Precision / Automatic Thinning and Polishing
Polishing Sample Holder with Three 1" Holes for Metallography 8'' high purity ceramic lapping plate
WarrantyOne year limited with lifetime support Rusting and damage due to improper storage condition or maintenance are not covered by warranty
ComplianceCE Certified
Package Dimensions40" x 38" x 30"
Shipping Weight160 lb
ApplicationsPolishing machine applications



Contact information:
contact person: Tanya Wang 
contact phone: 0086 371 55365392


Contact Us
  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




Follow Us

Copyright © Zhengzhou CY Scientific Instrument Co., Ltd. All Rights Reserved   

| Sitemap |       Technical Support: