10" Programmable Precision Lapping/Polishing Machine

CY-MP1000B can be used for lapping/polishing material samples, such as metal, crystal, glass, ceramic, refractory, rocks, PCB board and polymers, with size up to 10" in diameter. Customer can adjust the pressing force between the 150 mm Dia. sample loading plate (top) and 250 mm Dia. polishing plate (bottom), as well as their respective rotary speed to meet the processing requirement.