1. Equipment Introduction
The powder plasma cleaning machine is a vacuum low-temperature plasma surface treatment device equipped with a rotating drum/rotary bottle structure. It keeps powder particles continuously tumbling to solve the problem of powder accumulation and uneven treatment in conventional plasma equipment.
In a vacuum environment, the RF power supply ionizes process gas to generate plasma. High-energy ions and free radicals perform physical bombardment and chemical reactions on the surface of powder particles. Only the physical and chemical properties of the powder surface are modified, while the bulk properties of the powder material remain unchanged. The machine can realize powder cleaning, deoxidation, activation, etching and graft modification, and is applicable to various nano and micron-sized powder particles.
2. Functions
Surface Cleaning: Remove organic contaminants, oil stains, adsorbed water vapor, surface oxides and residual salt impurities on powder surfaces.
Surface Activation & Modification: Introduce active functional groups such as hydroxyl, carboxyl and amino groups to increase powder surface energy and adjust hydrophilic/hydrophobic properties.
De-agglomeration: Break up agglomerated nano-powder particles and greatly improve the dispersibility and compatibility of powder in solvents and resin matrices.
Micro-Etching / Ashing: Conduct micro-etching on powder surface and low-temperature ashing of organic powder.
Surface Grafting: Feed special process gas to graft functional groups onto powder surfaces for customized surface functions.
3. Application Fields
New Energy Materials: Cathode and anode powder for lithium batteries, fuel cell catalysts, electrode powder for supercapacitors; improve electrical conductivity, cycle stability and catalytic activity.
Ceramic & Inorganic Powder: Alumina, zirconia, silicon carbide, silica powder; enhance sintering activity and slurry dispersibility.
Polymer Powder: PTFE, PE, PP plastic powder, rubber powder; strengthen interfacial bonding force with fillers and adhesives.
Chemical Catalysis: Various catalyst powders, carbon black, carbon nanotubes; optimize catalytic active sites and boost reaction efficiency.
Research Laboratories: New material R&D in universities and research institutes, pre-treatment of nano-powder and research on material surface mechanisms.
Electronic Packaging Materials: Modify conductive and thermally conductive filler powder to improve thermal and electrical conductivity of composite materials.
4. Advantages
Uniform Treatment: Dynamic tumbling of the drum enables full contact between powder particles and plasma without dead zones, ensuring excellent batch consistency.
Fully Dry Process: No chemical solvents, waste water or waste liquid, eco-friendly and free of secondary impurity contamination to powder.
Low-Temperature Treatment: Low temperature rise of powder; suitable for heat-sensitive polymer powder without damaging bulk material performance.
Flexible Process: Adjustable power, treatment time, gas type and rotating speed; support switching among cleaning, activation and etching processes.
Wide Compatibility: Compatible with metal, ceramic, polymer and composite powders, covering a wide particle size range from nanometer to micron.
Safe & Easy Operation: Controlled by PLC touch screen with storage for multiple process formulas; built-in powder filter protection prevents powder from entering vacuum pumps and extends pump service life.
5. Technical Parameters
Product Name | Powder Plasma Cleaning Machine |
Model | CY-PC-FT |
Plasma Power Supply Frequency | 40KHz (13.56MHz RF optional) |
Output Power | 0–300W continuously adjustable (up to 1000–5000W for industrial models) |
Rotary Drum Volume | 1.5–3.5L (larger chambers customizable) |
Drum Rotation Speed | 0–30r/min adjustable |
Chamber Material | 316 stainless steel / quartz rotary bottle |
Ultimate Vacuum Degree | ≤1Pa |
Operating Vacuum Range | 10–500Pa |
Process Gas Path | Standard 2 channels, expandable to 4–6 channels; compatible with Ar, O₂, N₂, H₂, CF₄, etc. |
Gas Flow Control | MFC mass flow controller, 0–500SCCM adjustable |
Single Treatment Time | 1–60min adjustable |
Control System | PLC + touch screen, storage for ≥100 sets of process formulas |
Operating Temperature | Chamber temperature ＜50°C, low-temperature treatment |
Power Supply | AC220V 50Hz |
Protection Configuration | Powder filtration protection, vacuum, overload and over-temperature alarm protection |
