The magnetron sputtering/vacuum evaporation composite coating equipment combines magnetron sputtering technology and vacuum evaporation technology in one coating equipment.
The magnetron sputtering/vacuum evaporation composite coating equipment combines magnetron sputtering technology and vacuum evaporation technology in one coating equipment. In this device, magnetron sputtering cathode glow discharge is used to sputter the target atoms and partially ionize and deposit them on the substrate to form a film, and at the same time, the metal plating material can be melted in a vacuum by resistance heating and vaporized and then deposited on the substrate to form a film. This increases the utility and flexibility of the device. The equipment is used for metallization of plastic surface such as mobile phone case and deposition of non-conductive film and electromagnetic shielding film.
The magnetron sputtering/vacuum evaporation composite coating equipment is equipped with a plasma processing device, a high-efficiency magnetron sputtering cathode and a resistance evaporation device, etc. The deposition rate of this device is fast, the coating adhesion is good, the plating layer is fine and compact, the surface finish is high, the uniformity and consistency is good; the machine realizes full automatic control of coating process, large load, reliable work, high qualification rate, low production cost and green environmental protection.
The device is widely used in computer casings, mobile phone cases, household appliances and other industries, and can be coated with metal film, alloy film, composite film layer, transparent (translucent) film, non-conductive film, electromagnetic shielding film and the like.
Magnetron sputtering/vacuum evaporation composite coating equipment CY-MSE300S-DC
Temperature control accuracy
Tungsten wire basket
Precise temperature control
30-segment lifting and lowering temperature program can be set
φ300mm × 300mm
Top over open
Film thickness monitor
DC 5V (±10%), maximum current 400mA
Film thickness resolution
Film thickness accuracy
±0.5%, depending on process conditions, especially sensor position, material stress, temperature and density
Standard sensor crystal
RS-232/485 serial interface (baud rate 1200, 2400, 4800, 9600, 19200, 38400 can be set, data bit: 8, stop bit: 1, check: none)
8-bit resolution, PWM pulse width modulated output (open collector or internal 5V output)
Temperature 0-50℃, humidity 5%-85% RH, no condensation beads
DC 5V 3A
12×2 digital tube and LED
RS-485 (baud rate 1200, 2400, 4800, 9600, 19200, 38400 can be set, data bit: 8 bits, stop bit: 1 bit, parity: none)
Applicable wafer frequency
Applicable wafer size
Cooling water pipe
Φ3mm, length 00mm, 500mm, 1000mm
Cooling water pressure
Pneumatic baffle pipe
Water supply state <200℃, water-free state flange <100℃
2 channels; measuring range 100sccm; 100sccm (can be customized according to customer needs)
Rotary vane pump
Compound vacuum gauge
Molecular pump: 600L/S rotary vane pump: 1.1L/S Comprehensive pumping performance: The vacuum can reach 1.0E-3Pa in 20 minutes.
Various targets such as gold, indium, silver, and platinum
One year warranty, lifetime technical support.
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