Four-Target Magnetron Sputtering Coater with Load-Lock Chamber

The Four-Target Magnetron Sputtering Coater is a cost-effective magnetron sputtering coating equipment independently developed by our company. It features standardization, modularity, and customizability. Magnetic target sizes of 1 inch, 2 inches, 3 inches, and 4 inches are available for selection, allowing customers to choose based on the size of their substrates. The standard power supply configuration includes a 500W DC power supply and a 500W RF power supply. The DC power supply is suitable for preparing metal films, while the RF power supply is suitable for preparing non-metal films. The four targets can meet the needs for multi-layer or multiple coating cycles. If customers have other coating requirements, other RF power supplies and pulsed power supplies can be customized. Various power supplies are available in power ratings from 300W to 1000W. 

The equipment consists of a main chamber and a load-lock chamber. The load-lock chamber is equipped with a magnetic push rod, and a vacuum gate valve is installed between the two chambers. Users can load samples into the load-lock chamber and perform preliminary vacuum pumping while sputtering work is ongoing in the main chamber. Once sputtering in the main chamber is complete, samples can be transferred into the sample holder of the main chamber via the magnetic push rod. This design reduces the frequency of venting and pumping the main chamber, not only saving significant time but also ensuring better base vacuum, effectively improving coating quality.

The Four-Target Magnetron Sputtering Coater can be used to prepare single-layer or multi-layer films, including ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard coatings, PTFE films, etc. Compared to similar equipment, this coater not only has wide applications but also boasts the advantages of compact size and ease of operation, making it an ideal device for preparing material thin films in laboratories. The high vacuum environment ensures that the evaporation process occurs in a high vacuum, guaranteeing that evaporated atoms or molecules reach the substrate directly, avoiding contamination from air impurities and improving film quality. High vacuum conditions also help reduce oxidation of the evaporation material, further enhancing film purity and performance. 

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