Magnetron Sputtering Coater with Load Lock
This magnetron sputtering coater can be used to prepare single-layer or multi-layer ferroelectric thin films, conductive thin films, alloy thin films, semiconductor thin films, ceramic thin films, dielectric thin films, optical thin films, oxide thin films, hard thin films, PTFE thin films and other functional films.
The magnetron sputtering coater with load lock is a cost-effective magnetron sputtering coating equipment independently developed by our company, featuring standardized, modular and customizable design. Magnetron targets with sizes of 1-inch, 2-inch, 3-inch and 4-inch are optional for customers to select according to the size of substrates to be coated. It is equipped with a 1000W DC power supply and 500W RF power supply. The DC power supply is used for depositing metal thin films, while the RF power supply is applied to non-metal thin films. Three targets can meet the requirements of multi-layer or repeated coating. If customers have other coating demands, customized RF power supplies and pulse power supplies are available, with various power specifications ranging from 300W to 1000W for all models.
The equipment consists of a main vacuum chamber and a load lock chamber fitted with a magnetic push rod, and a vacuum gate valve is installed between the two chambers. While sputtering is running in the main chamber, users can load samples into the load lock and pre-evacuate it. Once the sputtering process in the main chamber is finished, samples can be pushed onto the sample stage in the main chamber via the magnetic push rod. This design reduces the frequency of vacuum pumping and venting of the main chamber, which effectively saves operation time, maintains superior base vacuum and greatly improves coating quality.
This magnetron sputtering coater can be used to prepare single-layer or multi-layer ferroelectric thin films, conductive thin films, alloy thin films, semiconductor thin films, ceramic thin films, dielectric thin films, optical thin films, oxide thin films, hard thin films, PTFE thin films and other functional films. Compared with similar equipment, this sputtering system boasts wide application range, compact footprint and easy operation, making it an ideal laboratory instrument for thin film material fabrication.
The entire deposition process is carried out under high vacuum environment, which ensures evaporated atoms or molecules reach the substrate directly without contamination from air impurities, thus improving film quality. High vacuum also minimizes oxidation of deposition materials and further enhances the purity and performance of thin films.
Technical Parameters：
Product Name | Magnetron Sputtering Coater with Load Lock |
Model No. | CY-MSH500X-III-2DCRF-SS-I-LK |
Input Power Supply | Single-phase AC 220V, 50Hz |
Sample Stage | Dimension: φ150mmHeating Temperature: RT ~ 500℃Rotating Speed: 1~20 rpm adjustable |
Magnetron Sputtering Guns | Equipped with 3 sets of 2-inch magnetron gunsTarget dimension: φ50.8mm, max thickness ≤3mmAdjustable angle: -45° ~ 45° |
High Vacuum Chamber | Chamber material: 304 stainless steel inner wallSize: φ500×500mmViewing window: φ100mm (with shutter)Opening type: front door with cylinder auxiliary supportCooling mode: water cooling |
Gas Control System | Dual-channel Mass Flow Controller (MFC)Oxygen channel: 0~200 sccmNitrogen channel: 0~200 sccm |
DC Power Supply | 1 set of 1000W DC power supply |
RF Power Supply | 2 sets of 500W RF power supply |
Load Lock Chamber | Max wafer size compatible: 4-inch |
Vacuum System – Backing Pump | 1 set of two-stage rotary vane pump, pumping speed: 4 L/s |
Vacuum System – Molecular Pump | Pumping speed: 1200 L/s |
Vacuum System – Vacuum Gauge | Composite vacuum gauge |
Film Thickness Monitor | CYKY film thickness monitor as standard configuration |
Control System | Full-automatic PLC control with touch operation interface |
Total Power | 5 KW |
